Plasma processing apparatus
US12148598B2 · kind B2 · utility
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2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2022 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Dec 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus includes: a plasma processing chamber; a first conductive member disposed in the plasma processing chamber and having a first surface; a second conductive member having a second surface facing the first surface of the first conductive member; a third member disposed on at least one selected from the group of the first conductive member and the second conductive member and having a shape that varies according to a temperature change of the third member; and a control mechanism configured to change a temperature of the third member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.