Patent · US Active

Method and apparatus for use in wafer processing

US12148640B2 · kind B2 · utility

0Cited by

7References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Fischer · Umkirch, DE
Gerald Lackner · Arnoldstein, AT
Walter Leitgeb · Wernberg, AT
Michael Lecher · Villach, AT

Key dates

Filing date	Jan 26, 2023
Grant date	Nov 19, 2024
Priority date	—
Expiry date	Jan 26, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/20
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In an embodiment a method includes placing a wafer on a receptacle comprising a chuck base, wherein a light port for emitting light from a source of light is an opening located in a surface of the chuck base, and wherein the light port is located underneath the wafer, shining the light from the light port at an edge of the wafer so that light passes by the edge of the wafer and processing the wafer on the receptacle based on the light that passed by the edge of the wafer and that is received by a light sensitive element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.