Substrate processing control using a measured size distribution of by-product particles
US12148674B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2021 |
| Grant date | Nov 19, 2024 |
| Priority date | — |
| Expiry date | Jun 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing method and a substrate processing apparatus for removing material on a substrate are disclosed. In order to remove the material, a processing liquid including a chemical liquid and water is supplied on the substrate so that a liquid layer maintained by surface tension is formed. The material is removed from the substrate by a reaction between the material and the processing liquid. A size distribution of by-product particles formed by the reaction between the material and the processing liquid is measured by a dynamic light scattering method. A supply of the processing liquid is controlled based on the size distribution of the by-product particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.