Chamber components with polished internal apertures
US12162115B2 · kind B2 · utility
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26References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2023 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Jun 28, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23B2226/18
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 μin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.