Stacked-dies optically bridged multicomponent package

US12164161B1 · kind B1 · utility

Assignee

• Celestial AI Inc. · US

Inventors

• Philip Winterbottom · Gillette, US
• David E. Lazovsky · San Jose, US
• Ankur Aggarwal · Pleasanton, US
• Martinus Bos · San Jose, US
• Subal Sahni · Village of La Jolla, US

Key dates

• Filing date: Mar 20, 2024
• Grant date: Dec 10, 2024
• Expiry date: Mar 20, 2044

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/4245
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An implementation provides a package that includes a first die including a bridging element, an analog/mixed-signal (AMS) die, and a general die. The first die includes: a first photonic transceiver portion, a first die first interconnect region, and an optical interface (OI). The AMS die includes a second photonic transceiver portion, an AMS die first interconnect region on a first surface of the AMS die electrically and physically coupled with the first die first interconnect region; and an AMS die second interconnect region on a second surface of the AMS die. The general die includes a third photonic transceiver portion, and a general die first interconnect region electrically and physically coupled with the second photonic transceiver portion.