Martinus Bos
21Patents
5h-index
16Co-inventors
66Inventor score
Filing activity: Nov 27, 2001 → Jun 13, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10237587B2 | Transporting out-of-band signals in distributed cable systems | Electricity | 23 | Active |
| US11509397B2 | Balanced photonic architectures for matrix computations | Physics | 14 | Active |
| US11835777B2 | Optical multi-die interconnect bridge (OMIB) | Physics | 13 | Active |
| US6767941B2 | Halogen-free flame-retardant composition | Chemistry; Metallurgy | 7 | Expired |
| US12216318B2 | Optical bridging element for separately stacked electrical ICs | Physics | 5 | Active |
| US8916637B2 | Aromatic polycarbonate composition | Chemistry; Metallurgy | 2 | Active |
| US12242122B2 | Multicomponent photonically intra-die bridged assembly | Physics | 1 | Active |
| US7446141B2 | Thermoplastic composition comprising an aromatic polycarbonate and/or a polyester with improved mould release behaviour | Chemistry; Metallurgy | 1 | Expired |
| US12298608B1 | Optically bridged multicomponent package with extended temperature range | Physics | 1 | Active |
| US12124095B2 | Optical multi-die interconnect bridge with optical interface | Physics | 1 | Active |
| US12353006B2 | Electro-photonic network for machine learning | Physics | 0 | Active |
| US12164162B2 | Multicomponent photonically bridged assembly | Physics | 0 | Active |
| US12392974B2 | Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute | Electricity | 0 | Active |
| US12405434B2 | Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute | Electricity | 0 | Active |
| US12399333B2 | Optical multi-die interconnect bridge with electrical and optical interfaces | Physics | 0 | Active |
| US7208542B2 | Glass fibre reinforced polycarbonate composition met improved toughness | Chemistry; Metallurgy | 0 | Expired |
| US12259575B2 | Clock signal distribution using photonic fabric | Physics | 0 | Active |
| US12164161B1 | Stacked-dies optically bridged multicomponent package | Physics | 0 | Active |
| US12339492B2 | Electro-photonic network for machine learning | Physics | 0 | Active |
| US12339490B2 | Clock signal distribution using photonic fabric | Physics | 0 | Active |
| US12271595B2 | Photonic memory fabric for system memory interconnection | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.