Multicomponent photonically bridged assembly
US12164162B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2024 |
| Grant date | Dec 10, 2024 |
| Priority date | — |
| Expiry date | Apr 11, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4245
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package comprises a first die and a bridging element. The first die includes a compute element and/or memory element, a first region, a first portion of a photonic transceiver, and a first die interconnect region. The first region intersects a center of the first die. The first portion of a photonic transceiver includes and AMS block with a driver and transimpedance amplifier, coupled with the first die interconnect region. The bridging element includes a modulator and photodetector, connected with a bridging interconnect region. An optical interface, photonically linked with the first photonic transceiver, routes packets from an external device optical interface to the compute and/or memory element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.