Patent · US Active

Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method

US12165959B2 · kind B2 · utility

0Cited by

1References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Frank Singer · Regenstauf, DE
Marcus Boehm · Schweinfurt, DE
Andreas Grassmann · Villach, AT
Martin Gruber · Schwandorf, DE
Uwe Schindler · Reichenbach, DE

Key dates

Filing date	Jan 15, 2021
Grant date	Dec 10, 2024
Priority date	—
Expiry date	Dec 28, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package includes a carrier, an electronic component on the carrier, an encapsulant encapsulating at least part of the carrier and the electronic component, and at least one lead extending beyond the encapsulant and having a punched surface, wherein at least part of at least one side flank of the encapsulant has a sawn texture.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.