Marcus Boehm
4Patents
1h-index
12Co-inventors
45Inventor score
Filing activity: Jan 6, 1987 → May 10, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4947219A | Particulate semiconductor devices and methods | Emerging Cross-Sectional Technologies | 88 | Expired |
| US10781859B2 | Rolling-element bearing assembly | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US12165959B2 | Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method | Electricity | 0 | Active |
| US12283538B2 | Molded semiconductor package having an embedded inlay | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.