Daisy-chain seal ring structure
US12170234B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2023 |
| Grant date | Dec 17, 2024 |
| Priority date | — |
| Expiry date | Jun 15, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06596
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first wafer and a second wafer. The semiconductor device includes a seal ring structure comprising a first metal structure in a body of the first wafer, a second metal structure in the body of the first wafer, a third metal structure in a body of the second wafer, and a metal bonding structure including a first set of metal elements coupling the first metal structure and the third metal structure through an interface between the first wafer and the second wafer, and a second set of metal elements coupling the second metal structure and the third metal structure through the interface between the first wafer and the second wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.