Integrated circuit assemblies with direct chip attach to circuit boards
US12170273B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2021 |
| Grant date | Dec 17, 2024 |
| Priority date | — |
| Expiry date | Oct 31, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various aspects of the present disclosure set forth IC dies, microelectronic assemblies, as well as related devices and packages, related to direct chip attach of dies and circuit boards. An example microelectronic assembly includes a die with IC components provided over the die's frontside, and a metallization stack provided over the die's backside. The die further includes die interconnects extending between the frontside and the backside of the die, to electrically couple the IC components and the metallization stack. The assembly further includes backside conductive contacts, provided over the side of the metallization stack facing away from the die, the backside conductive contacts configured to route signals to/from the IC components via the metallization stack and the die interconnects, and configured to be coupled to respective conductive contacts of a circuit board in absence of a package substrate between the die and the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.