Support unit, bake apparatus and substrate treating apparatus including the same
US12174553B2 · kind B2 · utility
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18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2022 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Jan 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a support unit including a support plate on which the substrate is placed, and a support protrusion provided on the support plate and separating the substrate from the support plate, wherein the support plate includes a first protrusion protruding from an upper surface of the support plate, wherein the first protrusion is provided in a support region provided by the support protrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.