Substrate processing apparatus and substrate processing method
US12176224B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2022 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Sep 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes: a substrate rotator configured to hold and rotate a substrate; an outer cup configured to annularly cover a periphery of the substrate held by the substrate rotator; an inner cup disposed inside the outer cup and under the substrate held by the substrate rotator; an annular drain formed between the outer cup and the inner cup to discharge a processing liquid supplied to the substrate outward; and an exhaust passage formed inside the inner cup, wherein the inner cup has an exhaust hole through which a liquid reception space, which is formed by the inner cup and the outer cup, and the exhaust passage are in communication with each other, and the exhaust hole is formed obliquely downward from an outer surface to an inner surface of the inner cup.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.