Electronic package and manufacturing method thereof
US12176291B2 · kind B2 · utility
0Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2022 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Jul 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.