Inventor · Taichung, TW

Chi-Ching Ho

15Patents

1h-index

19Co-inventors

47Inventor score

Filing activity: Oct 4, 2012 → Apr 24, 2024

Most-cited inventions

Patent	Title	Area	Cited by	Status
US11315881B1	Electronic package and manufacturing method thereof	Electricity	3	Active
US8810045B2	Packaging substrate and semiconductor package	Electricity	1	Active
US12334452B2	Electronic package and manufacturing method thereof	Electricity	0	Active
US9991197B2	Fabrication method of semiconductor package	Electricity	0	Active
US12412820B2	Electronic package and manufacturing method thereof	Electricity	0	Active
US9899235B2	Fabrication method of packaging substrate	Emerging Cross-Sectional Technologies	0	Active
US11923337B2	Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same	Electricity	0	Active
US12051641B2	Electronic package and manufacturing method thereof	Electricity	0	Active
US9265154B2	Packaging substrate and fabrication method thereof	Electricity	0	Active
US12199047B2	Electronic package and manufacturing method thereof	Electricity	0	Active
US12125828B2	Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same	Electricity	0	Active
US9165789B2	Fabrication method of packaging substrate	Electricity	0	Active
US9006039B2	Fabrication method of packaging substrate, and fabrication method of semiconductor package	Electricity	0	Active
US12176291B2	Electronic package and manufacturing method thereof	Electricity	0	Active
US12412819B2	Electronic package and manufacturing method thereof	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.