Apparatus and methods to transfer substrates into and out of a spatial multi-substrate processing tool
US12183618B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2020 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | Jun 29, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68771
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus and methods for loading and unloading substrates from a spatial processing chamber are described. A support assembly has a rotatable center base and support arms extending therefrom. A support shaft is at the outer end of the support arms and a substrate support is on the support shaft. Primary lift pins are positioned within openings in the substrate support. Secondary lift pins are positioned within openings in the support arms and are aligned with the primary lift pins. An actuation plate within the processing volume causes, upon movement of the support assembly, the primary lift pins to elevate through contact with the secondary lift pins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.