Printed circuit board having embedded component
US12185478B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2022 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | Jan 12, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosure pertains to a method for the bonding of a component embedded into a printed circuit board. The methods include provisions of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer. Methods may also include embedding at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer. Methods may also include application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component. Methods may also include clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.