Flexible circuit board and manufacturing method thereof
US12185479B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2022 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | Aug 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/096
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit board and a manufacturing method thereof are provided. The flexible circuit board includes a circuit structure, a first cover layer, and a second cover layer. The circuit structure has a top surface and a bottom surface opposite to the top surface. The circuit structure includes multiple circuit layers and multiple insulating layers stacked alternately. A material of the insulating layers is a photosensitive dielectric material and a Young's modulus of the insulating layers is between 0.36 GPa and 8 GPa. The first cover layer is disposed on the top surface of the circuit structure. The second cover layer is disposed on the bottom surface of the circuit structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.