Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device
US12186684B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2024 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Feb 13, 2044 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF04B23/04
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method for cleaning substrates includes rotating a substrate; delivering deionized water on a surface of the substrate for pre wetting the surface of the substrate; delivering chemical solution with high temperature on the surface of the substrate for cleaning the surface of the substrate; changing the rotation speed of the substrate to a low rotation speed, and moving a ultra/mega sonic device. The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a first cleaning cycle; turning off the ultra/mega sonic device, and delivering a high temperature chemical solution or deionized water. The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a second cleaning cycle; turning off the ultra/mega sonic device, and delivering rinse chemical solution or deionized water on the surface of the substrate; and drying the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.