Metrology data correction using image quality metric
US12189307B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Aug 14, 2019 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Apr 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/28
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for correcting metrology data of a patterning process. The method includes obtaining (i) metrology data of a substrate subjected to the patterning process and (ii) a quality metric (e.g., a focus index) that quantifies a quality of the metrology data of the substrate; establishing a correlation between the quality metric and the metrology data; and determining a correction to the metrology data based on the correlation between the quality metric and the metrology data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.