Systems and methods for faceplate temperature control
US12191169B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2020 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Jul 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B6/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The processing systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The processing systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The processing systems may include a faceplate heater seated on the faceplate. The faceplate heater may include a first heater coil extending proximate a first area of the faceplate. The faceplate heater may include a second heater coil extending proximate a second area of the faceplate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.