Semiconductor device including two-dimensional material
US12191392B2 · kind B2 · utility
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2References
20Claims
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Key dates
| Filing date | Oct 20, 2021 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Apr 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/882
Abstract
A semiconductor device according to an embodiment may include a substrate, an adhesive layer, and a semiconductor layer. The semiconductor layer includes a 2D material having a layered structure. The adhesive layer is interposed between the substrate and the semiconductor layer, and has adhesiveness to a 2D material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.