Near field wireless communication system for mother to package and package to package sideband digital communication

US12196807B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Zhen Zhou · Shanghai, CN
• Renzhi Liu · Portland, US
• Jong-Ru Guo · Portland, US
• Kenneth P. Foust · Beaverton, US
• Jason A. Mix · Portland, US
• Kai Xiao · Lo Wu, CN
• Zuoguo Wu · San Jose, US
• Daqiao Du · Lake Oswego, US

Key dates

• Filing date: Dec 24, 2020
• Grant date: Jan 14, 2025
• Expiry date: May 15, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04B5/48
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A package substrate may include a circuit and a leaky surface wave launcher. The circuit may perform engineering tests and end-user operations using sideband signals. The leaky surface wave launcher may perform near field wireless communication. The leaky surface wave launcher may include a via and a strip line. The via may be electrically coupled to the circuit. The via may provide the sideband signals to and receive the sideband signals from the circuit. The strip line may be electrically coupled to the via. The strip line may be excited by the sideband signals to wirelessly couple the leaky surface wave launcher with an external device. The strip line and the via may be unbalanced such that the strip line generates a leaky wave that propagates at least a portion of the package substrate and an environment proximate the package substrate.