Inventor · San Jose, CA, US

Zuoguo Wu

53Patents
7h-index
72Co-inventors
75Inventor score

Filing activity: Jun 29, 2004 → Jul 14, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10552357B2 Multichip package link Emerging Cross-Sectional Technologies 12 Active
US10552253B2 Multichip package link error detection Emerging Cross-Sectional Technologies 12 Active
US7495491B2 Inverter based duty cycle correction apparatuses and systems Electricity 9 Active
US9692402B2 Method, apparatus, system for centering in a high performance interconnect Electricity 9 Active
US10073808B2 Multichip package link Emerging Cross-Sectional Technologies 8 Active
US7579905B2 Reduced jitter amplification methods and apparatuses Electricity 7 Active
US7102381B2 Adaptive termination for optimum signal detection Electricity 7 Expired
US9946676B2 Multichip package link Physics 7 Active
US7663442B2 Data receiver including a transconductance amplifier Electricity 4 Active
US10050623B2 High performance repeater Electricity 4 Active
US7495489B2 Frequency multiplying delay-locked loop Electricity 4 Active
US9536863B2 Interconnection of a packaged chip to a die in a package utilizing on-package input/output interfaces Emerging Cross-Sectional Technologies 3 Active
US9444551B2 High performance optical repeater Electricity 3 Active
US8143911B2 Input/output driver swing control and supply noise rejection Electricity 2 Active
US9337939B2 Optical IO interconnect having a WDM architecture and CDR clock sharing receiver Electricity 2 Active
US10789201B2 High performance interconnect Electricity 2 Active
US9484888B2 Linear resistor with high resolution and bandwidth Electricity 2 Active
US11116072B2 Discrete circuit having cross-talk noise cancellation circuitry and method thereof Electricity 1 Active
US11003610B2 Multichip package link Emerging Cross-Sectional Technologies 1 Active
US10678736B2 Extending multichip package link off package Emerging Cross-Sectional Technologies 1 Active
US11043965B2 PCI express enhancements Physics 1 Active
US11450613B2 Integrated circuit package with test circuitry for testing a channel between dies Electricity 1 Active
US11061761B2 Multichip package link error detection Emerging Cross-Sectional Technologies 1 Active
US12117960B2 Approximate data bus inversion technique for latency sensitive applications Physics 1 Active
US11307928B2 Multichip package link error detection Emerging Cross-Sectional Technologies 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.