Method and apparatus for predicting yield of semiconductor devices
US12198061B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2021 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Nov 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for predicting the yield of manufacturing semiconductor devices includes steps of: acquiring defect data of semiconductor devices to be predicted, wherein the semiconductor devices to be predicted include finished semiconductor devices and semi-finished semiconductor devices, and the defect data indicates a defect type and location of at least one defect of the semiconductor devices; inputting the defect data into a pre-trained yield prediction model, wherein the yield prediction model includes a neural network structure and a classification structure, the neural network structure is used to extract defect feature vectors from the defect data, and the classification structure is used to output classification results of qualified or unqualified yield according to the defect feature vectors; and determining, by the yield prediction model, classification results of qualified or unqualified yield of the semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.