Vapor delivery head for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structures

US12198945B2 · kind B2 · utility

Assignee

• Lam Research Corporation · US

Inventors

• Bhaskar BANDARAPU · Villach, AT
• David Mui · Fremont, US
• Karl-Heinz Hohenwarter · Kötschach, AT
• Butch Berney · San Jose, US
• Nathan Lavdovsky · Beaverton, US
• Christian Putzi · Tulsa, US
• Hongbo Si · Plano, US
• Robert Johnson · Budd Lake, US
• Michael J. Klemm · Haan, DE
• Bernhard Loidl · Villach, AT

Key dates

• Filing date: Aug 21, 2019
• Grant date: Jan 14, 2025
• Expiry date: Jan 18, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/687
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A vapor delivery head for wet treatment of a substrate includes a body including an upper surface, a lower surface, an upper plenum and a lower plenum. A first bore is arranged on the upper surface of the body and fluidly connected to the upper plenum to supply heated fluid. A second bore is arranged on the upper surface of the body and connected to the upper plenum to remove heated fluid. A third bore is arranged on the upper surface of the body and connected to the lower plenum to receive a gas mixture. A plurality of through holes through the lower surface of the body are in fluid communication with the lower plenum.