Electronic package and manufacturing method thereof
US12199047B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Jan 10, 2022 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Jun 18, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0203
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.