Radio frequency front-end structures
US12200855B2 · kind B2 · utility
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1References
20Claims
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Assignee
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Key dates
| Filing date | Jan 22, 2024 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Jan 22, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.