Multi-input multi-zone thermal control for device testing

US12203979B2 · kind B2 · utility

Assignee

• Advantest Test Solutions, Inc. · US

Inventors

• Karthik Ranganathan · San Jose, US
• Gregory Cruzan · Anaheim, US
• Paul Ferrari · San Jose, US
• Samer Kabbani · San Marcos, US
• Martin Fischer · Gleichen, DE

Key dates

• Filing date: May 23, 2023
• Grant date: Jan 21, 2025
• Expiry date: May 23, 2043

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2875
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Placing a first side of an active thermal interposer device of a thermal management head against a device under test (DUT). Disposing a cold plate against a second side of the active thermal interposer. The DUT includes a die and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality of zones by controlling a supply of coolant to the cold plate, and individually controlling heating of each zone of the plurality of zones.