Patent · US Active

Contacting module for contacting optoelectronic chips

US12203983B2 · kind B2 · utility

0Cited by

3References

7Claims

0Family size

Assignee

Jenoptik Optical Systems GmbH · DE

Inventors

Robert BUETTNER · Jena, DE
Armin Grundmann · Jena, DE
Tobias Gnausch · Östringen, DE
Thomas Kaden · Dresden, DE
Stefan Franz · Munich, DE
Christian KARRAS · Jena, DE

Key dates

Filing date	Jan 27, 2021
Grant date	Jan 21, 2025
Priority date	—
Expiry date	Aug 21, 2041

Classification

Technology area (CPC G)Physics
CPC primaryG01R1/07
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A contacting module and a method for assembling a contacting module with an optical module, containing an optical block made of glass, and with an electronics module, the optical block being connected via an adhesive connection to the electronics module or the optical module having a mounting plate, which is mounted on the electronics module so as to be repeatedly releasable therefrom and is connected to the optical block via an adhesive connection. The adhesive connection is produced via at least three cylinder pins, which each have a first end face bearing against the optical block by an adhesive and are glued in through-bores in the carrier plate or the mounting plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.