Armin Grundmann
5Patents
1h-index
15Co-inventors
44Inventor score
Filing activity: Apr 21, 2009 → Apr 12, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11480495B2 | Position-tolerance-insensitive contacting module for contacting optoelectronic chips | Physics | 2 | Active |
| US12210057B2 | Wafer-level test method for optoelectronic chips | Physics | 0 | Active |
| US8519494B2 | Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate | Performing Operations; Transporting | 0 | Active |
| US12203983B2 | Contacting module for contacting optoelectronic chips | Physics | 0 | Active |
| US11906579B2 | Wafer-level test method for optoelectronic chips | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.