Patent · US Active

Wafer chuck for a laser beam wafer dicing equipment

US12205842B2 · kind B2 · utility

0Cited by

5References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Franz-Josef Pichler · Villach, AT
Johannes Mueller · Berlin, DE
Christoph Ahamer · Villach, AT
Gerald Lackner · Arnoldstein, AT
Walter Leitgeb · Wernberg, AT

Key dates

Filing date	Sep 12, 2022
Grant date	Jan 21, 2025
Priority date	—
Expiry date	May 4, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/68327
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chuck for a laser beam wafer dicing equipment includes a wafer support plate having an upper surface for holding a wafer disposed on a dicing tape. The upper surface includes a topographically structured surface region that partly or completely overlaps an edge of the wafer when the wafer disposed on the dicing tape is placed on the upper surface. The topographically structured surface region provides for a reduction in an area of contact between the upper surface and the dicing tape.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.