Systems and methods for pulse width modulated dose control
US12215421B2 · kind B2 · utility
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4References
13Claims
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Key dates
| Filing date | Dec 1, 2023 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Dec 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing system for treating a substrate includes N manifolds, Y groups of injector assemblies, and a dose controller, where Y and N are integers greater than one. Each of the Y groups of injector assemblies includes N injector assemblies located in a processing chamber. Each of the N injector assemblies in each group of injector assemblies is in fluid communication with one of the N manifolds, respectively, and includes a valve including an inlet and an outlet. The dose controller is configured to control pulse widths output to the Y groups of injector assemblies to provide temporal dosing of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.