Methods and systems of optical inspection of electronic device manufacturing machines
US12215966B2 · kind B2 · utility
0Cited by
15References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2020 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Dec 4, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB25J11/0055
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Implementations disclosed describe an inspection device capable of being transferred by a robot blade into a processing chamber of a manufacturing machine, the inspection device comprising an optical sensor to detect light reflected from a target located within the processing chamber, wherein the optical sensor is to output, to a processing device, a signal representative of a state of a region of a surface of the target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.