Memory array connections
US12217790B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2023 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Jul 31, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C11/4097
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A device includes a substrate, a first sense amplifier disposed on the substrate, a first word line driver disposed on the substrate and situated adjacent the first sense amplifier in the x-direction, and a first memory array disposed above the first sense amplifier and above the first word line driver in the z-direction. A plurality of first conductive segments extend alternately in the x-direction and the y-direction, and are disposed between the first memory array and the first sense amplifier and configured to electrically connect the first sense amplifier to a first bit line of the first memory array. A plurality of second conductive segments extend alternately in the x-direction and the y-direction, and are disposed between the first memory array and the first word line driver and configured to electrically connect the first word line driver to a first word line of the first memory array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.