Temperature controlled substrate carrier and polishing components
US12217979B2 · kind B2 · utility
0Cited by
9References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2020 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Jun 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0475
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Temperature controlled polishing pads are disclosed. In one aspect, a CMP system includes the use of any type of atomizing system to cool or remove energy and/or heat from the polishing pad of a CMP system. The atomizing system can use of any liquid medium in combination of any compressed gas through an orifice to cool or remove the energy and/or heat from the pad, thereby allowing for higher removal rates during CMP.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.