Apparatus for processing a wafer, and method of controlling such an apparatus
US12217980B2 · kind B2 · utility
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1References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 3, 2020 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Aug 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing a wafer comprises: a rotatable chuck adapted to receive a wafer; a heating assembly comprising an array of light-emitting heating elements arranged to illuminate a wafer received by the rotatable chuck to heat the wafer; and one or more light sensors arranged to detect light emitted by the array of light-emitting heating elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.