Wafer processing apparatus including EFEM and method of processing wafer
US12217984B2 · kind B2 · utility
0Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2022 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | May 4, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.