Semiconductor device with metal spacers and method for fabricating the same
US12218053B2 · kind B2 · utility
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10Claims
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Assignee
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Key dates
| Filing date | Nov 14, 2023 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Nov 14, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/535
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application discloses a semiconductor device including a substrate, an active area in the substrate, a first plug positioned above the active area, second plugs positioned above the active area, metal spacers positioned above the first plug and the plurality of second plugs, and air gaps respectively positioned between the plurality of metal spacers. The active area includes a narrow portion having a first width and two side portions having a second width, wherein the narrow portion is disposed between the two side portions, and the first width is less than the second width from a top view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.