Patent · US Active

Method of making an individualization zone of an integrated circuit

US12218083B2 · kind B2 · utility

0Cited by
1References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 21, 2021
Grant dateFeb 4, 2025
Priority date
Expiry dateDec 6, 2043

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH04L2209/12
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The invention relates to a method for making an individualization zone of a microchip comprising a first (10A) and a second (20A) level of electrical tracks (10, 20), and a conductor layer (30A) comprising via holes (30), the method comprising the following steps:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.