Substrate treating apparatus
US12224200B2 · kind B2 · utility
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0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2021 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Dec 14, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a heating unit that irradiates a beam to the substrate and heat the substrate, and the heating unit further includes an irradiation part that irradiates the beam, and a rotation part that rotates the beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.