Semiconductor packages with increased power handling
US12224218B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2022 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Aug 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8325
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor packages and, more particularly, semiconductor packages with increased power handling capabilities are disclosed. Semiconductor packages may include lead frame structures and corresponding housings that incorporate semiconductor die. To promote increased current and voltage capabilities, exemplary semiconductor packages include one or more arrangements of creepage extension structures, lead frame structures that may include integral thermal pads, additional thermal elements, and combinations thereof. Creepage extension structures may be arranged as part of top sides of semiconductor packages along with thermal pads of lead frame structures and additional thermal elements. Creepage extension structures may also be arranged as part of top sides and along on one or more peripheral edges of semiconductor packages to promote further increases in power handling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.