Devarajan Balaraman
11Patents
3h-index
16Co-inventors
53Inventor score
Filing activity: Aug 16, 2006 → Aug 24, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7749900B2 | Method and core materials for semiconductor packaging | Electricity | 22 | Active |
| US10304697B2 | Electronic device with top side pin array and manufacturing method thereof | Electricity | 4 | Active |
| US8174017B2 | Integrating three-dimensional high capacitance density structures | Electricity | 3 | Active |
| US10832921B2 | Electronic device with top side pin array and manufacturing method thereof | Electricity | 1 | Active |
| US8456016B2 | Method and core materials for semiconductor packaging | Electricity | 1 | Active |
| US12224233B2 | Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers | Electricity | 0 | Active |
| US10037957B2 | Semiconductor device and method of manufacturing thereof | Electricity | 0 | Active |
| USD1056862S1 | Semiconductor package | General | 0 | Active |
| US12224218B2 | Semiconductor packages with increased power handling | Electricity | 0 | Active |
| US10157872B2 | Semiconductor device and method of manufacturing thereof | Electricity | 0 | Active |
| US12205827B2 | Electronic device with top side pin array and manufacturing method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.