Plating apparatus and method for electroplating wafer
US12227865B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2022 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Oct 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating apparatus for electroplating a wafer includes a housing defining a plating chamber for housing a plating solution. A voltage source of the apparatus has a first terminal having a first polarity and a second terminal having a second polarity different than the first polarity. The first terminal is electrically coupled to the wafer. An anode is within the plating chamber, and the second terminal is electrically coupled to the anode. A membrane support is within the plating chamber and over the anode. The membrane support defines apertures, wherein in a first zone of the membrane support a first aperture-area to surface-area ratio is a first ratio, and in a second zone of the membrane support a second aperture-area to surface-area ratio is a second ratio, different than the first ratio.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.