Inventor · Tainan, TW

Szu-Hung Yang

10Patents
4h-index
35Co-inventors
60Inventor score

Filing activity: Dec 28, 1998 → Jul 25, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US6682659B1 Method for forming corrosion inhibited conductor layer Electricity 36 Expired
US9515021B1 Semiconductor structure and method of forming the same Electricity 15 Active
US6686292B1 Plasma etch method for forming uniform linewidth residue free patterned composite silicon containing dielectric layer/silicon stack layer Electricity 14 Expired
US8803271B2 Structures for grounding metal shields in backside illumination image sensor chips Electricity 4 Active
US9040317B2 Methods for achieving width control in etching processes Electricity 2 Active
US8872301B2 Dual profile shallow trench isolation apparatus and system Electricity 2 Active
US10367019B2 CMOS image sensor structure with crosstalk improvement Electricity 0 Active
US12227865B2 Plating apparatus and method for electroplating wafer Electricity 0 Active
US11401624B2 Plating apparatus and method for electroplating wafer Electricity 0 Active
US10957728B2 CMOS image sensor structure with crosstalk improvement Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.