Chao-Lung Chen
7Patents
2h-index
21Co-inventors
51Inventor score
Filing activity: Jan 20, 2004 → May 10, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11309265B2 | Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films | Electricity | 2 | Active |
| US7128821B2 | Electropolishing method for removing particles from wafer surface | Electricity | 2 | Expired |
| US7312149B2 | Copper plating of semiconductor devices using single intermediate low power immersion step | Electricity | 0 | Expired |
| US12051659B2 | Semiconductor devices having conductive pad structures with multi-barrier films | Electricity | 0 | Active |
| US11688703B2 | Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films | Electricity | 0 | Active |
| US12227865B2 | Plating apparatus and method for electroplating wafer | Electricity | 0 | Active |
| US11401624B2 | Plating apparatus and method for electroplating wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.