Substrate position calibration for substrate supports in substrate processing systems
US12228395B2 · kind B2 · utility
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5References
20Claims
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Key dates
| Filing date | Nov 19, 2021 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Mar 11, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB25J11/0095
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.