Deposition method and processing apparatus
US12230483B2 · kind B2 · utility
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3References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 6, 2023 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | May 13, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A stage includes a base and an electrostatic chuck provided on the base and including N electrodes in the electrostatic chuck, where N is an integer greater than or equal to two. The stage a power supply configured to apply voltages of different N-phases to the respective N electrodes. Each of the voltages has a positive level and a negative level that periodically alternate. A center line of an electrode gap provided between adjacent electrodes is represented by x=x=r·cos(θ+2π(n−1)/N) and y=r·sin(θ+2π(n−1)/N).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.