Methods and apparatus for cooling a substrate support
US12232299B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2022 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Aug 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for processing a substrate are provided herein. For example, an apparatus for processing a substrate comprises a process chamber configured to process a substrate, a substrate support comprising a heat sink configured to cool the substrate support during operation and a water trap panel comprising a pumping ring configured to cool the water trap panel such that the water trap panel condenses water vapor molecules and drops a process chamber pressure during operation, and a chiller operably coupled to the substrate support and configured to supply a cooling fluid to the substrate support via a cooling fluid line that connects to the heat sink and the pumping ring via a serial configuration or a parallel configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.