Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications
US12233483B2 · kind B2 · utility
0Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2019 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Sep 24, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 w. % copper, from 0.01 to 0.1 wt. % cobalt, from 0.1 to 2 wt. % silver, from 0.005 to 0.05 wt. % titanium, and from 0.01 to 1 wt. % nickel; optionally up to 1 wt. % of one or more of: vanadium, rare earth metals, neodymium, chromium, iron, aluminium, phosphorus, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium, silicon, and manganese; and the balance tin together with any unavoidable impurities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.